The hottest Japanese developed composite materials

2022-08-12
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Japan has developed a composite material that can realize 100 times the current of copper wire

the Japan Institute of Industrial Technology (hereinafter referred to as "Jiri") has developed a new material, which realizes the same conductivity as copper and about 100 times the current carrying capacity of copper (also known as the maximum current density) by combining single-layer carbon nanotube (CNT) and copper (Cu). The Institute said that this CNT Cu composite material can not only pass through high current, but also has light weight and high temperature resistance, so it can be used as a wiring material for ultra small high-performance semiconductor chips

so far, the overall wiring and inter chip wiring materials of semiconductor chips generally use copper, aluminum (AL), gold (AU) and other metals. However, although the conductivity of these metals is high, the current carrying capacity is not necessarily large. When a high voltage of more than a certain value is applied, this voltage will cause the atomic structure to collapse, which will cause a sharp increase in resistance and eventually lead to wire breakage

from the perspective of application, with the progress of micro refinement technology, the current carrying capacity of wiring requirements for semiconductor chips is also gradually increasing. According to the industry comprehensive research institute, by 2015, the required ampacity will reach 1million a/cm2 (10 graphene can be used as a substitute material for other filling systems) that Cu and Au cannot achieve. While CNT, graphene and other "nano carbon materials" have a current carrying capacity of about 1 billion (109) a/cm2. This is because carbon atoms have strong coupling ability. Even if a high voltage is applied, it is difficult to cause the atomic structure to collapse. However, the conductivity of this material is less than 1/100 of that of Cu and Au. Previously, researchers have not found a material with the same current carrying capacity as CNT and the same conductivity as Cu

cnt can inhibit the diffusion of Cu

cnt Cu composite is composed of CNT and Cu, which realizes the above two characteristics at the same time for the first time. Its current carrying capacity is 6.3 × 108a/cm2, up to about 100 times that of Cu

3 is the implementation of the national big data strategy. According to the industry research institute, the reason why new materials can obtain such a high current carrying capacity is that CNT can inhibit the diffusion of Cu. In this CNT Cu composite, CNT and Cu form a structure like "iron reinforced concrete", and CNT plays a role in enhancing the "strength" of Cu under high voltage

at room temperature, the conductivity of this composite is equivalent to that of Cu. But even at a high temperature of about 200 ℃, the conductivity of the new material will not be significantly reduced, which is better than Cu

according to the introduction of the comprehensive research on production, the manufacturing process of new materials is basically to electroplate CNT in a solution containing Cu ions. The key point is to slowly electroplate CNT in organic solution with current density of 1m ~ 5ma/cm2, rather than rapidly copper plating in aqueous solution. In this way, Cu can be filled in the CNT structure

at present, there is a price gap of more than 1000 times

the biggest problem of this composite material is that the cost of single-layer CNT is still very high. At present, the cost of single-layer CNT is 1000 ~ 10000 yen/g (depending on the purity), which is similar to 4300 yen/g. the method is as follows: About Au. The cost of Cu is only about 0.76 yen/g, and there is a great price gap between single-layer CNT and it

when manufacturing single-layer CNTs this time, the Institute adopted the "super growth" jointly developed by the Institute and Japanese companies such as ryon, which is a process that can manufacture high-purity single-layer CNTs. Rui Weng plans to officially mass produce single-layer CNTs using the overspeed growth method from 2015. It is possible to reduce the manufacturing cost to about 10 yen/g in the future

the industry comprehensive research institute said that in the future, it will jointly develop the specific uses of new materials with manufacturers to promote practicality

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